2,3,3',4'-Biphenyltetracarboxylic dianhydride
[CAS# 36978-41-3]

Identification

• Classification: Chemical reagent >> Organic reagent >> Carboxylic anhydride
• Name: 2,3,3',4'-Biphenyltetracarboxylic dianhydride
• Synonyms: (4,5'-Biisobenzofuran)-1,1',3,3'-tetrone
• Molecular Formula: C₁₆H₆O₆
• Molecular Weight: 294.21
• CAS Registry Number: 36978-41-3
• EC Number: 811-539-3
• SMILES: C1=CC(=C2C(=C1)C(=O)OC2=O)C3=CC4=C(C=C3)C(=O)OC4=O

Safety Data

• Hazard Symbols: GHS07 Warning
• Risk Statements: H315-H319-H335
• Safety Statements: P261-P264-P264+P265-P271-P280-P302+P352-P304+P340-P305+P351+P338-P319-P321-P332+P317-P337+P317-P362+P364-P403+P233-P405-P501

Hazard Classification

Hazard	Class	Category Code	Hazard Statement
Eye irritation	Eye Irrit.	2	H319
Skin irritation	Skin Irrit.	2	H315
Specific target organ toxicity - single exposure	STOT SE	3	H335

Discovery and Applications

2,3,3',4'-Biphenyltetracarboxylic dianhydride (BPDA) is a high-performance chemical compound first synthesized in the mid-20th century. This compound, characterized by its robust structure and thermal stability, was discovered during research focused on developing advanced materials for industrial applications. BPDA, with the molecular formula C18H6O6, is composed of two benzene rings connected by a biphenyl linkage and features four carboxylic acid groups that form two anhydride units. Its discovery marked a significant advancement in the field of polymer chemistry.

BPDA is a key monomer in the production of polyimides, which are used extensively in high-performance applications due to their exceptional thermal stability, mechanical properties, and chemical resistance. These polyimides are employed in environments that require materials to maintain integrity at high temperatures.

In the electronics industry, BPDA-based polyimides are used as insulating films, substrates, and dielectrics. Their excellent electrical properties and stability make them suitable for flexible printed circuit boards (PCBs), insulating layers in semiconductors, and as protective coatings for electronic components.

The aerospace industry relies on BPDA-derived polyimides for their lightweight, durable, and heat-resistant properties. These materials are used in the manufacture of composite structures, thermal insulations, and adhesive bonds that must endure the harsh conditions of aerospace environments. Their ability to perform at both cryogenic and high temperatures makes them indispensable for spacecraft, satellites, and aircraft components.

In the automotive sector, BPDA-based polyimides are used to produce components that require high thermal and chemical resistance, such as gaskets, seals, and insulation materials. These properties are critical for parts that operate under the hood, where temperatures and exposure to chemicals can be extreme.

Beyond aerospace and automotive uses, BPDA-based polyimides find applications in various industrial processes that demand high-performance materials. These include coatings for chemical processing equipment, membranes for gas separation, and high-strength fibers for industrial textiles.

References

2024. Preparation and properties of semi-alicyclic thermoplastic polyimide sheets from stereoisomeric hydrogenated pyromellitic dianhydrides and fluorinated diamine. Journal of Polymer Research, 31(3).
DOI: 10.1007/s10965-024-03934-4

2022. Polyimide foam composites with nano-boron nitride (BN) and silicon carbide (SiC) for latent heat storage. Advanced Composites and Hybrid Materials, 5(1).
DOI: 10.1007/s42114-022-00426-1

2021. Experimental Study on Polyimide Foam for Satellite. Advances in Astronautics Science and Technology, 4(3).